Our Technology
3D Packaging & CPO Design
Our innovative strengths lie in our deep technical expertise that allow us to create a unique integration.
3D packaging + CPO architecture
Simulation-guided process improvement
Thermal, stress and optical alignment co-design
Higher bandwidth density with better watts/bit
The Bottleneck of Advanced Packaging Complexity
Thermal Density
Local hotspots and thermo-optic shifts
Mechanical Warpage
Alignment drift and fiber-coupling loss
Fragmented Workflows
Slow FEM loops and manual parameter extraction
NetForce Physics-First
AI-Driven Platform
ECM links electromagnetic, thermal, mechanical and carrier-gain behavior into one design framework.
2445 Augustine Drive, Suite 150
Santa Clara, CA 95054
Legal
Privacy Policy
Terms and Conditions
© 2026 NetForce OE Labs. All rights reserved.